方维（副教授）
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- 硕士生导师
- 电子邮箱：
- 所在单位：智能工程与自动化学院
- 学历：研究生毕业
- 性别：男
- 学位：博士学位
- 在职信息：在职
- 毕业院校：北京航空航天大学
- 所属院系：智能工程与自动化学院
- 通讯/办公地址：
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- Wei Fang*, Lixi Chen, Lei Han, Ji Ding. Context-aware cognitive augmented reality assembly: Past, present, and future:Journal of Industrial Information Integration, 2025, 44: 100780.
- Tienong Zhang, Yuqing Cui, Wei Fang*. Integrative human and object aware online progress observation for human-centric augmented reality assembly:Advanced Engineering Informatics, 2024, 64: 103081.
- Wei Fang*, Lixi Chen, Tienong Zhang, et al. Co2iAR: Co-located audio-visual enabled mobile collaborative industrial AR wiring harness assembly[J]. Robotics and Computer–Integrated Manufacturing, 2024, 90: 102795.
- Wei Fang*, Tienong Zhang, Zeyu Wang, et al. A multi-modal context-aware sequence stage validation for human-centric AR assembly[J]. Computers & Industrial Engineering, 2024, 194:110355.
- Wei Fang*, Zhan Teng, Qiankun Zhang, et al. A natural bare‑hand interface‑enabled interactive AR assembly guidance[J]. The International Journal of Advanced Manufacturing Technology, 2024, 133:3193-3207.
- Wei Fang*, Lixi Chen, Tienong Zhang, et al. Head-mounted display augmented reality in manufacturing: A systematic review[J]. Robotics and Computer–Integrated Manufacturing, 2023, 83: 102567.
- Wei Fang*, Tienong Zhang, Lixi Chen, et al. A survey on HoloLens AR in support of human-centric intelligent manufacturing[J]. Journal of Intelligent Manufacturing, 2023, 36: 35-59.
- Wei Fang*, Wei Fan, Wei Ji, et al. Distributed cognition based localization for AR-aided collaborative assembly in industrial environments[J]. Robotics and Computer-Integrated Manufacturing, 2022, 75: 102292.
- Wei Fang*, Jianhao Hong. Bare-hand gesture occlusion-aware interactive augmented reality assembly[J]. Journal of Manufacturing Systems, 2022, 65, 169-179.
- Mingyu Fu, Wei Fang*, Shan Gao, et al. Edge computing driven scene-aware intelligent augmented reality assembly[J]. The International Journal of Advanced Manufacturing Technology, 2022, 119:7369-7381.