Affiliation of Author(s):北京邮电大学
Teaching and Research Group:科研楼334
Journal:AIP Advances
Key Words:Semiconductors, Compressive stress, Thermal analysis, Thermal effects, Tensile stress, Finite-elemen
Indexed by:Journal paper
Document Code:085007
Discipline:Engineering
First-Level Discipline:Electronic Science and technology *
Document Type:J
Volume:8
Issue:8
ISSN No.:2158-3226
Translation or Not:no
Date of Publication:2018-08-07
Included Journals:SCI、SCI
Attachments:
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Gender:Male
Alma Mater:中国科学院半导体研究所
Education Level:研究生毕业
Degree:博士学位
Status:在职
School/Department:电子工程学院
Discipline:信息与通信工程* Information and communication engineering. Electronic Science and technology *
Business Address:科研楼334
Contact Information:010-61198040-604
PostalAddress : 北京邮电大学科研楼334
OfficePhone : 010-61198040
email : wangjun12@bupt.edu.cn
Honors and Titles:
2012年北京市科学技术三等奖 2013
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