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上一条:Yilin Zhou*, Ying Li, Yanyu Chen, Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board under NaCl Solution, Journal of Electronic Materials, 2020, 49(3): 2066-2075.
下一条:Yilin Zhou*, Ying Li, Yanyu Chen, Meng Zhu, Life Model of the Electrochemical Migration Failure of Printed Circuit Boards under NaCl Solution, IEEE Transactions on Device Materials Reliability, 2019, 19(4): 622-629.