周怡琳
- 电子邮箱：ylzhou@bupt.edu.cn
- 所在单位：人工智能学院
- 学历：研究生毕业
- 办公地点：校本部（西土城校区）主楼1408室
- 性别：女
- 联系方式：ylzhou@bupt.edu.cn
- 学位：博士学位
- 职称：教授
- 在职信息：在职
- 毕业院校：北京邮电大学
- 博士生导师
- 硕士生导师
- 学科：控制科学与工程 电子信息
- 所属院系：人工智能学院
访问量：
-
[1]
Xiaohui Liu, Xueli Jia, Lijing Wei, Yilin Zhou*, Long-term Degradation Prediction of Proton Exchange Membrane Fuel Cells under Different Conditions, Applied Energy, on review.
-
[2]
Bin Liang, Hansheng Zhang, Jiayi Qian, Yilin Zhou*, Investigation on the performance degradation characteristics of the sliding electrical contact of the brush and slip ring, The 8th International Conference on Reliability of Electrical Products and Electrical Contacts (ICREPEC’2022), Xiamen, Fujian, China, November 18-20, 2022.
-
[3]
Meng Zhu, Fangyao Zhong, Xiao Li, Yilin Zhou*, Xiaoqin Wei, Impact of complex environment on insertion loss of optical fiber connectors, Optical Technology, Semiconductor Materials and Devices, Xiamen, Fujian, Oct. 28-30, 2022.
-
[4]
曾辉，李晓，陈俊杰，周怡琳*，基于热仿真的轨道交通电连接系统载流能力研究, 现代城市轨道交通, 2022年第9期，51-56。
-
[5]
Xueli Jia, Xiaohui Liu, YilinZhou*，Performance Degradation and Life Prediction of Proton Exchange Membrane Fuel Cell，2022 Prognostics and Health Management Conference，London, United Kingdom, May 27-29, 2022，Best Paper Award.
-
[6]
Yilin Zhou*, Ying Li, Yirun Zhao, Wenrui Lu, Electrochemical Migration of Immersion Silver Plated Printed Circuit Boards Contaminated by Dust Solution, IEEE Transactions on Device and Materials Reliability, March 2021, 21(1): 117-128.
-
[7]
Yilin Zhou*, Yirun Zhao, Lu Yang, Ying Li, Wenrui Lu, Data-driven Life Modeling of Electrochemical Migration on Printed Circuit Boards under Soluble Salt Contamination, IEEE Access, 2020, 8:182580-182590.
-
[8]
Yilin Zhou*, Ying Li, Yanyu Chen, Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board under NaCl Solution, Journal of Electronic Materials, 2020, 49(3): 2066-2075.
-
[9]
周怡琳，杨 璐，鲁文睿,尘土颗粒影响下电路板电化学迁移失效寿命建模探索, 2020, 43(3): 11-18，31。
-
[10]
Yilin Zhou*, Ying Li, Yanyu Chen, Meng Zhu, Life Model of the Electrochemical Migration Failure of Printed Circuit Boards under NaCl Solution, IEEE Transactions on Device Materials Reliability, 2019, 19(4): 622-629.
