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上一条:Yilin Zhou*, Ying Li, Yirun Zhao, Wenrui Lu, Electrochemical Migration of Immersion Silver Plated Printed Circuit Boards Contaminated by Dust Solution, IEEE Transactions on Device and Materials Reliability, March 2021, 21(1): 117-128.
下一条:Yilin Zhou*, Ying Li, Yanyu Chen, Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board under NaCl Solution, Journal of Electronic Materials, 2020, 49(3): 2066-2075.