Yilin Zhou*, Ying Li, Yanyu Chen, Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board under NaCl Solution, Journal of Electronic Materials, 2020, 49(3): 2066-2075.
上一条:Yilin Zhou*, Yirun Zhao, Lu Yang, Ying Li, Wenrui Lu, Data-driven Life Modeling of Electrochemical Migration on Printed Circuit Boards under Soluble Salt Contamination, IEEE Access, 2020, 8:182580-182590.
下一条:周怡琳,杨 璐,鲁文睿,尘土颗粒影响下电路板电化学迁移失效寿命建模探索, 2020, 43(3): 11-18,31。